Form 8-K · Current report
NXP Semiconductors 8-K, filed Sep 2, 2026
- Filed
- CIK
- 0001413447
- Accession no.
- 0001413447-26-000051
Summary
NXP B.V., a wholly owned subsidiary of NXP Semiconductors N.V., entered into a $250.0 million unsecured senior loan facility with the European Investment Bank on September 1, 2026, with proceeds expected to fund design and implementation of an expansion of an existing semiconductor assembly and test facility in Kuala Lumpur, Malaysia. The obligations are fully and unconditionally guaranteed by NXP Semiconductors N.V., NXP Funding LLC and NXP USA, Inc. under a guaranty agreement dated September 2, 2026, and NXP said it may enter into a potential second facility agreement.
Key points
- The Facility Agreement provides for a $250.0 million unsecured senior loan facility with a maximum tenor of six years.
- Borrowings may be U.S. Dollar or Euro-denominated and bear a fixed or floating interest rate, with margin determined by NXP Semiconductors' credit rating.
- Proceeds are expected to fund the design and implementation of an expansion of an existing back-end semiconductor assembly and test facility in Kuala Lumpur, Malaysia.
- Covenants and events of default are generally consistent with those in NXP's Amended and Restated Revolving Credit Agreement dated February 6, 2026.
Written by an AI model from the filing text. It can be incomplete or wrong; the filing on SEC.gov is the record.
Items reported
- 1.01Entry into a Material Definitive Agreement
- 2.03Creation of a Direct Financial Obligation or an Obligation under an Off-Balance Sheet Arrangement of a Registrant
- 9.01Financial Statements and Exhibits
From the filing
Item 1.01 Entry into a Material Definitive Agreement Facility Agreement On September 1, 2026, NXP B.V., a wholly owned, direct subsidiary of NXP Semiconductors N.V. (the “Company”), entered into a facility agreement (the “Facility Agreement”) with European Investment Bank (“EIB”), which provides for a $250.0 million unsecured senior loan facility. The proceeds from borrowings under the Facility Agreement are expected to be used, to fund the design and implementation of an expansion of an existing semiconductor assembly and test facility (also called back-end manufacturing) located in Kuala Lumpur, Malaysia. …
An excerpt of the text as filed with the SEC, cut for length.
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